DEEP Application Process
Registration for DEEP 2017 is now closed and applications are currently under review. Thank you too all who applied.
DEEP is open to students currently in grades 9 to 12 (2016-17 school year).
Each course is one week. Students can choose to attend one, two, three or four weeks of DEEP. Follow a single course stream through multiple weeks of DEEP to get fully immersed in a particular subject area, attend DEEP Leadership Camp, or select courses from different streams to customize your learning.
There are no prerequisites for the courses, with one exception. Any changes to course prerequisites will be communicated well before registration time. In order to take a course during Design and Innovation Week in Week 4, students must have taken at least one course or participated in DEEP Leadership Camp during the first three weeks of DEEP.
DEEP Leadership Camp is open to students in grades 10 to 12.
When submitting your online application, you will be asked to pay a non-refundable $50 application fee.
There are two documents you must upload in order to complete your application:
– A recent unofficial transcript or report card from the last year showing your most recent or final grades from completed or in-progress science and math courses
– Your statement of interest (a short essay explaining why you want to attend DEEP)
Submit your online application, supplementary documents and $50 application fee by the deadline. We will let you know if you have been accepted into the program via email.
If accepted into the program, admitted cohorts of students will be prompted to select courses online. Details will be provided to admitted students at that time.
If accepted into the program, those who have selected residence and Leadership Camp options will be asked to provide additional information via an online profile form. Details will be provided to admitted students at that time.
If you have questions about DEEP or the application process:
Contact a DEEP representative at (416) 946-0816 or email@example.com.